Wiring substrate

Abstract

A wiring substrate includes a first wiring layer, a first insulating layer, and a second wiring layer. The first insulating layer covers the first wiring layer. The second wiring layer is formed on an upper surface of the first insulating layer and is electrically connected to the first wiring layer. The upper surface of the first insulating layer includes a first roughened surface, and a second roughened surface having a greater roughness than the first roughened surface. The second roughened surface includes a wrinkle pattern resulting from buckling. A volume percent of the first wiring layer located in a first region that overlaps the first roughened surface in plan view is greater than a volume percent of the first wiring layer located in a second region that overlaps the second roughened surface in plan view.

Dependencies are inferred from the claim text.