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US 2025/0062200 A1Published application
Semiconductor Package
AssigneeDuksan Hi-Metal Co., Ltd.
InventorsOh Heebong, Park Soon-Ho, Eun Dong Jin, Pyun Min Wook, Jang Hyun-Ji, Park Eun Kwang, Kim Jin-Gyu, Lee Chan-Gyu
Life of this patent
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Abstract
In one aspect of the present invention, the connection pin comprises a columnar structure with a diameter ranging from 60 to 500 micrometers (μm) and an aspect ratio (length to diameter) ranging from 1 to 10. Furthermore, the angle formed between the horizontal and vertical surfaces of the said structure is characterized by being between 90°±3°.
Claims18
A semiconductor package comprising:
- a semiconductor chip;
- a first connector mounted on a first surface of the semiconductor chip and having a first connection surface;
- a second connector having a second connection surface;
- and
- a connection pin with an aspect ratio (length/diameter) of 1 to 10, wherein the first end of said connection pin electrically connects to said first connection surface and the second end of said connection pin electrically connects to said second connection surface,
- wherein a solder joint is provided between said first connection surface and said first end of the connection pin.
3 more elements
A semiconductor package comprising:
- a semiconductor chip;
- a first connector having a first connection surface to which a terminal of the semiconductor chip connects;
- a connection pin with an aspect ratio (length/diameter) of 1 to 10, wherein the first end of said connection pin electrically connects to said first connection surface and the second end of said connection pin electrically connects to a terminal of the semiconductor chip,
- wherein a solder joint is provided between said first connection surface and said first end of the connection pin.
1 more element
A method for manufacturing a semiconductor package, the method comprising the steps of:
- providing a first connector with a first connection surface;
- connecting a first end and a second end of a connection pin with an aspect ratio (length/diameter) of 1 to 10 to the first connection surface;
- attaching a semiconductor chip to the first connector;
- filling around the semiconductor chip with resin for protection;
- providing a second connector with a second connection surface opposite the first connector;
- connecting a second end of the connection pin to the second connection surface.
3 more elements
Dependencies are inferred from the claim text.