Semiconductor device and method of forming components for semiconductor device
AssigneeVishay Silliconix LLC
InventorsLim CHEE CHIAN, Tuang KWANG HWEE, Yew-Khuan TEOH, Barry LIN, Stanley LAI
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Abstract
A semiconductor device and method of forming semiconductor components is disclosed herein. In one aspect, the semiconductor components are formed from a common lead frame in which a die attach pad and a source clip are initially connected to each other. Formation of the semiconductor can either include cutting the source clip from the die attach pad and then stacking a die therebetween, or folding the source clip over the die attach pad such that the source clip is folded over a die attached to the die attach pad.
Claims23
A semiconductor device comprising:
- a die attach pad connected at a first position to a source clip by a first source clip connecting bar, and connected at a second position to a gate clip by a gate clip connecting bar;
- a die positioned on the die attach pad;
- a source lead;
- and
- a gate lead;
- wherein the source clip is bent over at least a portion of the die attach pad such that at least a portion of the source clip provides electrical contact between at least a portion of the die and the source lead;
- and
- wherein the gate clip is bent over at least a portion of the die attach pad such that at least a portion of the gate clip provides electrical contact between at least a portion of the die and the gate lead.
A semiconductor device comprising:
- a die attach pad comprising a first portion of a source clip connection bar, and a first portion of a gate clip connection bar;
- a source clip comprising a second portion of the source clip connection bar;
- a gate clip comprising a second portion of the gate clip connection bar;
- a die positioned on the die attach pad;
- a source lead;
- and
- a gate lead;
- wherein the source clip is positioned over at least a portion of the die attach pad such that at least a portion of the source clip provides electrical contact between at least a portion of the die and the source lead;
- and
- wherein the gate clip is positioned over at least a portion of the die attach pad such that at least a portion of the gate clip provides electrical contact between at least a portion of the die and the gate lead.
A method of forming a semiconductor device, comprising:
- providing a lead frame comprising a conductive material;
- and
- machining the lead frame to form:
- a first die attach pad and a second die attach pad,
- a source clip connected to the first die attach pad by at least a first source clip connecting bar and connected to the second die attach pad by a second source clip connecting bar,
- a gate clip connected to the die attach pad by a gate clip connecting bar,
- a source lead, and
- a gate lead.
Dependencies are inferred from the claim text.