Optimized chip cooling infrastructure
OwnerEric C. PETERSON, Husam Atallah ALISSA +1inventors
InventorsEric C. PETERSON, Husam Atallah ALISSA, Sean Patrick ABBOTT
Life of this patent
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Abstract
A cold plate assembly for cooling a computing device includes a first cooling structure and a second cooling structure. The first cooling structure is configured to provide cooling from a flow of first coolant to a first temperature section of the computing device. The second cooling structure is connected to the first cooling structure and is configured to provide cooling from a flow of second coolant to a second temperature section of the computing device. The second temperature section has a lower temperature threshold than the first temperature section. The cold plate assembly includes a thermal barrier between the first cooling structure and the second cooling structure.
Claims20
A cold plate assembly for cooling a computing device, comprising:
- a first cooling structure configured to provide cooling from a flow of first coolant to a first temperature section of the computing device;
- a second cooling structure connected to the first cooling structure and configured to provide cooling from a flow of second coolant to a second temperature section of the computing device, the second temperature section having a lower temperature threshold than the first temperature section;
- and
- a thermal barrier between the first cooling structure and the second cooling structure.
A cold plate assembly for cooling a computing device, comprising:
- a first cooling structure having a first coolant inlet and a first coolant outlet for connecting the first cooling structure to a first coolant loop, the first cooling structure being configured to provide cooling to a first temperature section of the computing device;
- a second cooling structure connected to the first cooling structure and having a second coolant inlet and a second coolant outlet for connecting the second cooling structure to a second coolant loop at a lower temperature than the first coolant loop, the second cooling structure being configured to provide cooling to a second temperature section of the computing device, the second temperature section having a lower temperature threshold than the first temperature section;
- and
- a thermal barrier between the first cooling structure and the second cooling structure.
A method of cooling a computing device having a first temperature section and a second temperature section, comprising:
- flowing a first coolant to a first cooling structure of a cold plate assembly;
- cooling the first temperature section with the first cooling structure;
- flowing a second coolant to a second cooling structure of the cold plate assembly connected to the first cooling structure;
- and
- cooling the second temperature section with the second cooling structure.
Dependencies are inferred from the claim text.