Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYi-Ling CHEN, Kuan-Wei CHUANG
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Abstract
An electronic package and a manufacturing method thereof are provided, in which an offset suppression layer is formed on a carrier, a first electronic element and a second electronic element are respectively disposed on the offset suppression layer, and an encapsulant is formed on the offset suppression layer to respectively cover the first electronic element and the second electronic element. The offset suppression layer effectively suppresses or prevents possible offset caused by the encapsulant to the first electronic element and the second electronic element, thereby avoiding yield loss of the semiconductor package.
Claims20
An electronic package, comprising:
- a carrier;
- an offset suppression layer having a first surface and a second surface opposing the first surface, wherein the offset suppression layer is formed on the carrier via the second surface;
- a first electronic element and a second electronic element disposed on the first surface of the offset suppression layer;
- and
- an encapsulant formed on the first surface of the offset suppression layer and covering the first electronic element and the second electronic element, wherein the offset suppression layer suppresses an offset of the first electronic element and the second electronic element.
A method of manufacturing an electronic package, comprising:
- forming an offset suppression layer having a first surface and a second surface opposing the first surface on a carrier via the second surface;
- disposing a first electronic element and a second electronic element on the first surface of the offset suppression layer;
- and
- forming an encapsulant on the first surface of the offset suppression layer to cover the first electronic element and the second electronic element, wherein the offset suppression layer suppresses an offset of the first electronic element and the second electronic element.
Dependencies are inferred from the claim text.