Thermal interconnect for integrated circuitry
AssigneeTelefonaktiebolaget LM Ericsson (publ)
InventorsEmil NYLANDER, Per INGELHAG, Benny GUSTAFSON, Agneta LJUNGBRO
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Abstract
There is disclosed an electronic device comprising a printed circuit board, PCB, the PCB having one or more thermal vias filled with thermally conductive material. The electronic device further having a package, the package including a substrate and a die, the die having an active side with integrated circuity, and a heat-removal side. The heat-removal side of the die is in thermally conductive connection with the one or more thermal vias via solder balls. The disclosure also pertains to related devices and methods.
Claims20
An electronic device comprising:
- a printed circuit board, PCB, the PCB comprising one or more thermal vias filled with thermally conductive material;
- and
- a package, the package comprising a substrate and a die, the die having an active side with integrated circuity, and a heat-removal side, the heat-removal side of the die is being in thermally conductive connection with the one or more thermal vias via solder balls.
A package for an electronic device, the package comprising:
- a substrate;
- and
- a die, the die having an active side with integrated circuity, and a heat-removal side, the heat-removal side being adapted for being connectable via a thermally conductive connection to one or more thermal vias of a printed circuitry board, PCB, via solder balls.
A method of soldering a package to a printed circuit board, PCB, the PCB comprising one or more thermal vias filled with thermally conductive material, the package comprising a substrate and a die having an active side with integrated circuity and a heat-removal side, the method comprising:
- soldering solder balls to provide a thermally conductive connection of the heat-removal side of the die with the one or more thermal vias.
Dependencies are inferred from the claim text.