Semiconductor Package With Thermal Conductive Structure and the Methods of Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChao-Wei Chiu, Hsuan-Ting Kuo, Hsiu-Jen Lin, Ching-Hua Hsieh
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Abstract
A method includes depositing a first metal layer on a package component, wherein the package component comprises a first device die, forming a dielectric layer on the package component, and plating a metal thermal interface material on the first metal layer. The dielectric layer includes portions on opposing sides of the metal thermal interface material. A heat sink is bonded on the metal thermal interface material. The heat sink includes a second metal layer physically joined to the metal thermal interface material.
Claims20
A method comprising:
- depositing a first metal layer on a package component, wherein the package component comprises a first device die;
- forming a first dielectric layer on the package component;
- forming a metal thermal interface material on the first metal layer, wherein the first dielectric layer comprises portions on opposing sides of the metal thermal interface material;
- and
- bonding a heat sink on the metal thermal interface material, wherein the heat sink comprises a second metal layer bonding to the metal thermal interface material through metal-to-metal direct bonding.
A structure comprising:
- a package component comprising a first device die;
- a metal layer over and in physical contact with the package component;
- a metal thermal interface material on the metal layer;
- and
- a heat sink bonding to the metal thermal interface material, wherein the heat sink comprises a meta layer physically joined to the metal thermal interface material.
A structure comprising:
- an interposer comprising first edges;
- a first device die and a second device die over and bonding to the interposer;
- a metallic feature over and contacting the first device die and the second device die, wherein the metallic feature comprises:
- a lower portion comprising second edges vertically aligned to respective ones of the first edges;
- and
- an upper portion, wherein the upper portion is laterally recessed from the upper portion;
- and
- a metal lid over and bonding to the upper portion.
Dependencies are inferred from the claim text.