Semiconductor device
AssigneeDenso Corporation
InventorsHiroshi UKEGAWA, Takanori KAWASHIMA, Akinori SAKAKIBARA
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Abstract
The semiconductor device includes a semiconductor module and a cooler. The semiconductor module includes an insulator substrate, an inner conductor film disposed on a first surface of the insulator substrate, a semiconductor element connected to the inner conductor film, a sealing body sealing the inner conductor film and the semiconductor element, and an outer conductor film disposed on a second surface of the insulator substrate and exposed from a surface of the sealing body. The cooler is disposed adjacent to the outer conductor film via a thermal interface material having fluidity. The outer conductor film has a protruding portion or a recessed portion on a surface being in contact with the thermal interface material.
Claims10
A semiconductor device comprising:
- a semiconductor module including
- an insulator substrate having a first surface and a second surface opposite to each other,
- an inner conductor film disposed on the first surface of the insulator substrate,
- a semiconductor element connected to the inner conductor film,
- a sealing body sealing the inner conductor film and the semiconductor element and having a first surface and a second surface opposite to each other, and
- an outer conductor film disposed on the second surface of the insulator substrate and is exposed from the first surface of the sealing body;
- and
- a cooler disposed adjacent to the outer conductor film via a thermal interface material having fluidity, wherein
- the outer conductor film has a recessed portion on a surface being in contact with the thermal interface material, and
- the recessed portion includes at least one groove extending in an annular shape along an outer peripheral edge of the outer conductor film and located apart from an outer peripheral edge of the semiconductor element by an angle of 45 degrees or more.
Dependencies are inferred from the claim text.