Package structure and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorHsu-Nan FANG
Life of this patent
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Abstract
A package structure and a method for manufacturing the same are provided. The package structure includes an electronic device, a heat spreader, an intermediate layer and an encapsulant. The electronic device includes a plurality of electrical contacts. The intermediate layer is interposed between the electronic device and the heat spreader. The intermediate layer includes a sintered material. The encapsulant encapsulates the electronic device. A surface of the encapsulant is substantially coplanar with a plurality of surfaces of the electrical contacts.
Claims20
A package structure, comprising:
- a first electronic device;
- a second electronic device;
- a reinforcement layer laterally covering the first electronic device and the second electronic device;
- and
- an encapsulant at least partially encapsulating the first electronic device, wherein in a cross section, a portion of an upper surface of the encapsulant is in a gap between the first electronic device and the second electronic device.
A package structure, comprising:
- an electronic device;
- a heat spreader;
- an intermediate layer interposed between the electronic device and the heat spreader;
- an encapsulant at least partially encapsulating the electronic device;
- and
- a first monolithic solder solely disposed under the electronic device in a cross section.
A package structure, comprising:
- an electronic device including a plurality of electrical contacts;
- a heat spreader;
- an intermediate layer interposed between the electronic device and the heat spreader, and
- an encapsulant at least partially encapsulating the electronic device, wherein the encapsulant encapsulates a step structure collectively defined by an end portion of the intermediate layer and an end portion of the heat spreader.
Dependencies are inferred from the claim text.