Daisy-chain seal ring structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Liang LU, Chun-Wei CHIA, Chun-Hao CHOU, Kuo-Cheng LEE
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Abstract
A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.
Claims20
A semiconductor device, comprising:
- one or more first metal structures in a first wafer;
- one or more second metal structures in a second wafer;
- and
- a metal bonding structure coupling the one or more first metal structures and the one or more second metal structures;
- and
- at least one of:
- a first trench structure through a first portion of the first wafer and exposing a first portion of a first metal structure of the one or more first metal structures, or
- a second trench structure through a second portion of the first wafer and exposing a first portion of a second metal structure of the one or more first metal structures.
A method, comprising:
- forming a seal ring structure in a first wafer and a second wafer;
- and
- forming one or more first trench structures, or one or more second trench structures, in at least one of the first wafer or the second wafer,
- wherein at least one of:
- the one or more first trench structures are formed in the first wafer and expose one or more first metal structures in the first wafer, or
- the one or more second trench structures are formed within the first wafer and the second wafer.
A semiconductor device, comprising:
- a seal ring structure, comprising:
- one or more first metal structures in a first wafer,
- one or more second metal structures in a second wafer, and
- a metal bonding structure coupling the one or more first metal structures and the one or more second metal structures;
- and
- one or more trench structures formed in the first wafer and the second wafer.
Dependencies are inferred from the claim text.