Wafer cleaning apparatus and method of controlling the same
AssigneeZeus Co., Ltd.
InventorsSeung Dae BAEK, Kuem Dong HEO, Sung Yup KIM, Jae Hwan SON, Nam Jin KIM, Jun Goo PARK
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Abstract
A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.
Claims10
A method of controlling a wafer cleaning apparatus, the method comprising:
- restraining, by an expander module, a ring cover unit;
- mounting a wafer on a vacuum chuck unit;
- pressing, by the expander module, the ring cover unit such that a gap between dies of the wafer widens;
- restraining, by a chucking module, the ring cover unit to the vacuum chuck unit;
- and
- spaying, by an ultrasonic cleaning module, a cleaning solution onto the wafer and applying ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.
Dependencies are inferred from the claim text.