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US 2025/0062152 A1Published application
Dicing film and method of manufacturing semiconductor package by using the same
AssigneesSamsung Electronics Co., Ltd., Seoul National University R&Db Foundation
InventorsHyungjun Kim, Cheol-Hee Ahn, Yooseon Hong
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Abstract
In a dicing film, an adhesive strength of an adhesive layer constituting the dicing film may sufficiently decrease after heat treatment, and a semiconductor die may be easily separated from the dicing film. Accordingly, the effect of improving pickup performance of the semiconductor die may be obtained.
Claims21
A dicing film comprising:
- a base layer;
- an intermediate layer on the base layer;
- and
- an adhesive layer on the intermediate layer,
- wherein the adhesive layer includes an acrylate polymer composition including acrylonitrile.
2 more elements
A pressure sensitive adhesive comprising
- an acrylate polymer composition including acrylonitrile in a range of 3 wt % to 50 wt %,
- wherein an adhesive strength of the pressure sensitive adhesive increases after an ultraviolet treatment is performed thereon, and
- the adhesive strength of the pressure sensitive adhesive decreases after a heat treatment is performed thereon.
A method of manufacturing a semiconductor package, the method comprising:
- preparing a substrate structure with a first surface bonded on a carrier substrate;
- bonding, to a dicing film, a second surface of the substrate structure opposite to the first surface;
- separating the carrier substrate from the substrate structure and performing an ultraviolet treatment thereon;
- bonding a solder ball to the first surface of the substrate structure and performing a heat treatment thereon;
- separating the substrate structure into a plurality of semiconductor dies by cutting the substrate structure along a dicing line;
- debonding and picking up the semiconductor dies from the dicing film;
- and
- forming the semiconductor dies into semiconductor packages, respectively,
- wherein the dicing film comprises:
- a base layer;
- an intermediate layer on the base layer;
- and
- an adhesive layer on the intermediate layer, and
- wherein the adhesive layer includes an acrylate polymer composition including acrylonitrile.
11 more elements
21-25. (canceled)
Dependencies are inferred from the claim text.