Manufacturing method of electronic device

A manufacturing method of an electronic device, comprising:

• providing a plurality of semiconductor elements;
• performing a packaging process on the plurality of semiconductor elements to form a plurality of packaged semiconductor elements, wherein the packaging process comprises:
• disposing a plurality of filling material layers respectively on a sidewall of each of the plurality of semiconductor elements;
• providing a first substrate, wherein the first substrate includes a plurality of recesses;
• disposing the plurality of packaged semiconductor elements in the plurality of recesses of the first substrate through fluid transfer;
• providing a second substrate, wherein the second substrate includes a plurality of working areas;
• and
• transferring at least a portion of the plurality of packaged semiconductor elements from at least a portion of the plurality of recesses of the first substrate to the plurality of working areas.