Back to results
US 2025/0062148 A1Published application
Automated semiconductor substrate polishing and cleaning methods
AssigneeGlobalWafers Co., Ltd.
InventorsShinBae Park, SangJun Kim
Life of this patent
Estimating the term…
Abstract
Semiconductor wafer processing methods for processing a set of semiconductor wafers includes positioning a cassette within a wet bath with an automated guided vehicle (AGV), guiding the cassette within the wet bath, transferring the wafer from a transfer location to the cassette with a transfer robot; and removing the cassette and the wafer from the wet bath with the AGV.
Claims20
A method of processing a wafer, the method comprising:
- positioning a cassette within a wet bath with an automated guided vehicle (AGV);
- guiding the cassette within the wet bath with an AGV centering guide positioned in the wet bath and a centering rod of the AGV;
- transferring the wafer from a transfer location to the cassette with a transfer robot;
- and
- removing the cassette and the wafer from the wet bath with the AGV.
2 more elements
A method of processing wafers, the method comprising:
- positioning, with an automated guided vehicle (AGV), a cassette within a cassette holder inside of a wet bath, the wet bath including a wall defining a container for retaining a cleaning solution, wherein the cassette holder is attached to the wall and includes extensions for engaging the wafers;
- transferring the wafers from a transfer location to the cassette with a transfer robot;
- interdigitating the extensions between the wafers;
- and
- removing the cassette and the wafers from the wet bath with the AGV.
2 more elements
Dependencies are inferred from the claim text.