Module tray cover and semiconductor device case including the same
AssigneeSamsung Electronics Co., Ltd.
InventorTaegeon Kim
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AssigneeSamsung Electronics Co., Ltd.
InventorTaegeon Kim
Estimating the term…
A module tray cover includes a cover structure configured to cover a module tray that accommodates a plurality of semiconductor devices; a card accommodation portion provided on an upper surface of the cover structure and configured to accommodate a card, the card accommodation portion providing a first accommodation space and a second accommodation space partially overlapped with the first accommodation space; and an upper reinforcement structure including a first plurality of upper reinforcement structures and a second plurality of upper reinforcement structures, the first and second pluralities of upper reinforcement structures being spaced apart from each other in the first and second accommodation spaces, respectively, wherein the first and second pluralities of upper reinforcement structures respectively include first and second pluralities of upper reinforcement ribs sequentially disposed from open side portions of the first and second accommodation spaces.
A module tray cover, comprising:
A module tray cover, comprising:
A semiconductor device case, comprising:
Dependencies are inferred from the claim text.