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US 2025/0062141 A1Published application
System and method for wafer wet process
AssigneesTaiwan Semiconductor Manufacturing Company, Ltd., Tsmc China Company Limited
InventorsJie CHEN, Chuang LI, Qiang SU, Haobo NI
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Abstract
A method includes placing a wafer in a process bath filled with a process solution; determining whether the wafer is in the process bath after a pre-set process time after placing the wafer in the process bath; and in response the determination determines that the wafer is in the process bath after the pre-set process time, draining the process solution from the process bath while the wafer is in the process bath.
Claims20
A method, comprising:
- placing a wafer in a process bath filled with a process solution;
- determining whether the wafer is in the process bath after a pre-set process time after placing the wafer in the process bath;
- and
- in response the determination determines that the wafer is in the process bath after the pre-set process time, draining the process solution from the process bath while the wafer is in the process bath.
1 more element
A method, comprising:
- placing a wafer in a process bath of a wet process apparatus, wherein the process bath is filled with a process solution;
- providing a trigger signal to a control module;
- and
- performing a wafer rescue process using the control module after the control module receives the trigger signal, wherein the wafer rescue process comprises:
- draining the process solution from the process bath.
2 more elements
A system, comprising:
- a wet process apparatus comprising a process bath, a drain line fluidly connected to the process bath, and a first pneumatic valve coupled to the drain line;
- and
- a control module external to the wet process apparatus, wherein the control module comprises a first air pipe interface fluidly connected with the first pneumatic valve.
Dependencies are inferred from the claim text.