Package structure and method for fabricating the same
AssigneesTaiwan Semiconductor Manufacturing Company, Ltd., National Taiwan University
InventorsTzu-Hsuan CHANG, Rong-Teng Lin, Bi-Xian Wu, Teng-Chin Hsu, Yun-Hong Yang, Chien-Liang Chen, Jam-Wem Lee, Kuo-Ji Chen, Wun-Jie Lin
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Abstract
A method for fabricating a package structure is provided. The method includes premixing cellulose nanofibrils (CNFs) and a graphene material in a solvent to form a solution; removing the solvent from the solution to form a composite filler; mixing a prepolymeric material with the composite filler to form a composite material; and performing a molding process using the composite material.
Claims20
A method for fabricating a package structure, comprising:
- premixing cellulose nanofibrils (CNFs) and a graphene material in a solvent to form a solution;
- removing the solvent from the solution to form a composite filler;
- mixing a prepolymeric material with the composite filler to form a composite material;
- and
- performing a molding process using the composite material.
A method for fabricating a package structure, comprising:
- dispersing a graphene material in a first solvent;
- replacing the first solvent with a second solvent to form a solution;
- adding a 1D nanomaterial into the solution, wherein the 1D nanomaterial has a higher length-to-width ratio than the graphene material;
- drying the solution to form a composite filler after adding the 1D nanomaterial;
- mixing a prepolymeric material with the composite filler to form a composite material;
- and
- encapsulating a die using the composite material.
A package structure, comprising:
- a die;
- and
- an encapsulant surrounding the die, wherein the encapsulant comprises:
- a polymeric material;
- and
- a network in the polymeric material, wherein the network comprises 1D nanomaterial and a 2D material, the 1D nanomaterial has a higher length-to-width ratio than the 2D material, wherein an in-plane electrical conductivity of the 2D material is greater than an electrical conductivity of the polymeric material, and a weight ratio of the 2D material in the encapsulant is in a range from about 25% to about 80%.
Dependencies are inferred from the claim text.