Power semiconductor module arrangement and method for producing the same

A method, comprising:

• filling a first material having a first density in a housing to form a liquid or gel-like first pre-layer, wherein the housing comprises sidewalls, and a substrate with at least one semiconductor body arranged thereon is arranged in or forms a ground surface of the housing, and wherein the first pre-layer partly fills the housing and completely covers the substrate and the at least one semiconductor body arranged thereon;
• filling a second material different from the first material and having a second density in the housing, the first density being higher than the second density, to form a liquid or gel-like second pre-layer, wherein the first pre-layer forms between the second pre-layer and the substrate;
• and
• performing a curing step, the curing step simultaneously curing the first material and the second material and forming a solid first layer and a solid second layer, wherein the second layer permanently adheres to the first layer.