Method for forming patterns on a substrate
AssigneeCommissariat à I'Énergie Atomique et aux Énergies Alternatives
InventorsPierre Montmeat, Franck Fournel
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Abstract
A method comprising the following steps: a) bonding a handle substrate including a base and raised elements to a substrate of interest including a support substrate covered with a thin film, the thin film including a material sensitive to an etchant, whereby the thin film includes first areas not covered with the raised elements and second areas covered with the raised elements, b) performing an etching with the etchant to remove the material sensitive to the etchant present in the first areas, the second areas being protected during the etching, whereby the thin film is structured in the form of raised patterns, c) separating the handle substrate from the substrate of interest.
Claims11
Method of structuring a substrate of interest comprising the following steps:
- a) bonding a handle substrate to a substrate of interest, the handle substrate comprising a base and raised elements covering the base, the substrate of interest comprising a support substrate covered by a thin film, the thin film comprising a material sensitive to an etchant, whereby the thin film comprises first areas not covered with the raised elements and second areas covered with the raised elements,
- b) performing a wet or gaseous etching with the etchant to remove the material sensitive to the etchant present in the first areas, the second areas being protected during the etching, whereby the thin film is structured in the form of raised patterns,
- c) separating the handle substrate from the substrate of interest.
Dependencies are inferred from the claim text.