Substrate processing method and substrate processing apparatus

A substrate processing apparatus that processes a substrate having a pattern including a recess portion, the substrate processing apparatus comprising:

• a substrate holding portion that horizontally holds the substrate;
• a substrate rotating portion that rotates the substrate holding portion about a central axis extending in an up-down direction and that rotates the substrate together with the substrate holding portion;
• a processing liquid supply portion that supplies a processing liquid to the substrate;
• a plurality of guards that surround the substrate and that receive the processing liquid discharged from the substrate;
• an elevating/lowering portion that individually elevates and lowers the plurality of guards and that switches a guard surrounding the substrate among the plurality of guards;
• and
• a control portion that controls the substrate rotating portion, the processing liquid supply portion, and the elevating/lowering portion, wherein the processing liquid includes a first chemical liquid, a first rinse liquid, and a second chemical liquid,
• the plurality of guards include a first guard and a second guard,
• the control portion is configured or programmed to perfor:
• first chemical liquid processing in which the first chemical liquid is supplied to the substrate while controlling the processing liquid supply portion;
• rinse processing in which the first rinse liquid is supplied to the substrate while controlling the processing liquid supply portion;
• removal processing in which the substrate is rotated while controlling the substrate rotating portion in a state in which supply of the first rinse liquid is stopped by controlling the processing liquid supply portion and in which the first rinse liquid is discharged from the recess portion, and the first rinse liquid is removed from the substrate;
• second chemical liquid processing in which the second chemical liquid is supplied to the substrate from which the first rinse liquid has been removed while controlling the processing liquid supply portion;
• processing in which the substrate is rotated during the first chemical liquid processing, during the rinse processing, and during the second chemical liquid processing while controlling the substrate rotating portion;
• processing in which the first chemical liquid discharged from the substrate that is rotating is received by the first guard during the first chemical liquid processing while controlling the elevating/lowering portion;
• and
• processing in which the guard surrounding the substrate is switched from the first guard to the second guard, and the first rinse liquid and the second chemical liquid discharged from the substrate that is rotating are received by the second guard during the removal processing and during the second chemical liquid processing while controlling the elevating/lowering portion during the rinse processing.