Touchpad assembly

A touchpad assembly, comprising

• a cover plate;
• a touch circuit board disposed under the cover plate, the touch circuit board comprising a first touch electrode layer, a second touch electrode layer, and a single-layer embedded coil layer disposed away from the cover plate;
• a carrying mechanism having a central accommodating portion;
• a magnet group disposed in the central accommodating portion and constituting a vibration module together with the single-layer embedded coil layer, wherein a pressing gap is formed between the touch circuit board and the magnet group;
• and
• a plurality of vibration isolators disposed between the touch circuit board and the carrying mechanism, wherein a maximum press-down deformation, when pressing on a central area of the cover plate, is from 0.3 mm to 0.7 mm;
• the vibration module is configured to generate a vibration acceleration from 2 G to 15 G;
• and a total thickness of the touchpad assembly is from 2.5 mm to 3.5 mm.