See-through computer display systems

A method comprising:

• dissipating heat via a heat sink disposed between a first reflecting surface of a first optical module of a wearable head device and a second optical module of the wearable head device, wherein:
• the wearable head device comprises a frame;
• the first optical module comprises an upper region disposed at a first height with respect to the frame;
• the wearable head device further comprises a first electronics board disposed adjacent to the frame, further disposed horizontally with respect to the frame, and further disposed between the first optical module and the second optical module at a height less than the first height;
• the wearable head device further comprises a second electronics board disposed adjacent to the frame, further disposed horizontally with respect to the frame, and further disposed between the first optical module and the second optical module at a height substantially equal to the first height,
• the first electronics board is separated from second electronics board by an air gap,
• one of the first electronics board and the second electronics board comprises a processor;
• the heat sink is thermally coupled to the processor;
• and
• the heat sink is disposed between the first reflecting surface and the second optical module and is further disposed in front of the processor with respect to the frame.