Photosensitive substrate developing method, photomask creating method, and electronic device manufacturing method

A creating method of a photomask used in photolithography using a pulse laser beam including a plurality of center wavelengths, the creating method comprising:

• measuring a wafer pattern of a second test wafer that is exposed by scanning the second test wafer in a first direction with a pulse laser beam via a second test mask and is developed by supplying a developer to a surface of the second test wafer heated so as to have a temperature distribution having a temperature gradient in a second direction intersecting the first direction on the surface of the second test wafer in each of a plurality of scan fields included in the second test wafer, to acquire a measured wafer pattern indicating measurement results in each of a plurality of divided regions aligned in the second direction;
• creating a corrected mask pattern for creating the photomask based on a test mask pattern formed on the second test mask, the measured wafer pattern, and a target pattern which is a target wafer pattern of a photosensitive substrate;
• and
• creating the photomask based on the corrected mask pattern.

An electronic device manufacturing method, comprising:

• generating a pulse laser beam including a plurality of center wavelengths with a laser apparatus;
• outputting the pulse laser beam to an exposure apparatus;
• performing exposure by scanning each of a plurality of scan fields included in a photosensitive substrate in a first direction with the pulse laser beam via a photomask in the exposure apparatus;
• heating the exposed photosensitive substrate so as to have a temperature distribution having a temperature gradient in a second direction intersecting the first direction on a surface of the photosensitive substrate in each of the scan fields;
• and
• supplying a developer to the surface of the photosensitive substrate to perform development after heating the photosensitive substrate.