Method of fabricating semiconductor structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Wei KUO, Wen-Shiang Liao
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Abstract
A semiconductor structure including a semiconductor substrate, a first patterned dielectric layer, a grating coupler and a waveguide is provided. The semiconductor substrate includes an optical reflective layer. The first patterned dielectric layer is disposed on the semiconductor substrate and covers a portion of the optical reflective layer. The grating coupler and the waveguide are disposed on the first patterned dielectric layer, wherein the grating coupler and the waveguide are located over the optical reflective layer.
Claims20
A method, comprising:
- providing a semiconductor wafer comprising embedded optical reflective layers;
- and
- bonding photonic dies carried by a carrier to the embedded optical reflective layers of the semiconductor wafer through a wafer-to-wafer bonding process;
- removing the carrier after the wafer-to-wafer bonding process;
- and
- performing a singulation process to obtain singulated semiconductor structures.
A method, comprising:
- providing photonic dies on a first semiconductor substrate;
- performing a first transfer-bonding process to bond photonic dies from the first semiconductor substrate to a carrier;
- after performing the first transfer-bonding process, performing a second transfer-bonding process to bond the photonic dies from the carrier to a second semiconductor substrate comprising embedded optical reflective layers;
- and
- performing a singulation process to cut the second semiconductor substrate to obtain singulated semiconductor structures.
A method, comprising:
- forming a grating coupler and a waveguide embedded in a dielectric layer carried by a first substrate;
- patterning the dielectric layer to from patterned semiconductor structures on the first substrate;
- transfer-bonding the patterned semiconductor structures from the first substrate to a carrier;
- providing a second substrate comprising optical reflective layers;
- and
- bonding the patterned semiconductor structures carried by the carrier to the optical reflective layers.
Dependencies are inferred from the claim text.