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US 2025/0060347 A1Published application
Gas detector with thermal dissipation
AssigneeHand Held Products, Inc.
InventorsSungsoo Kang, Dongil Ko, Sangsu Park, KiHo Bang
Life of this patent
Estimating the term…
Abstract
A gas detector is provided. The gas detector has a housing defining a cavity and a display module is disposed within the cavity. The display module has a first PCB, a base plate, a metal enclosure, and a thermal gap pad. The metal enclosure is positioned on top of the base plate, and the thermal gap pad is disposed in between the metal enclosure and the second PCB. The second PCB is disposed on top of the thermal gap pad.
Claims20
A gas detector comprising:
- a housing defining a cavity, the housing comprising a top part and a bottom part, the top part coupled to the bottom part;
- a display module positioned within the cavity of the housing, the display module comprising:
- a first PCB;
- a second PCB;
- a base plate;
- a metal enclosure;
- and
- a thermal gap pad, wherein the metal enclosure is positioned on top of the base plate, and the thermal gap pad is disposed in between the metal enclosure and the second PCB, wherein the second PCB is positioned in between the first PCB and the thermal gap pad.
5 more elements
A display module comprising:
- a first PCB;
- a second PCB;
- a base plate;
- a metal enclosure;
- and
- a thermal gap pad, wherein the metal enclosure is positioned on top of the base plate, and the thermal gap pad is disposed in between the metal enclosure and the second PCB, wherein the second PCB is positioned in between the first PCB and the thermal gap pad.
3 more elements
A gas detector comprising:
- a housing defining a cavity;
- a display module positioned within the cavity of the housing, the display module comprising:
- a first PCB;
- a second PCB;
- a base plate;
- a metal enclosure;
- and
- a thermal gap pad, wherein the metal enclosure is positioned on top of the base plate, and the thermal gap pad is disposed in between the metal enclosure and the second PCB, wherein the second PCB is disposed on top of the thermal gap pad.
5 more elements
Dependencies are inferred from the claim text.