Electrolytic solution for copper foil, and electrolytic copper foil

Abstract

An electrolytic solution for a copper foil, and the preparation and use of an electrolytic copper foil. The electrolytic solution for a copper foil comprises an additive, wherein the additive comprises an inhibitor and an auxiliary agent. The auxiliary agent comprises at least one of polystyrene sulfonate, polyethylene sulfonate, alkyl sulfonate and alkylbenzene sulfonate, wherein both the alkyl sulfonate and the alkyl benzene sulfonate have ≥12 carbon atoms. By means of simple and convenient chemical regulation and control means such as the selection and combination of additives for an electrolytic (electroplating) solution, a pre-electroplated copper material resulting from electroplating using the electrolytic solution can form a high-proportion annealing twin boundary after a heat treatment at a temperature of ≥200° C., and has the unique mechanical characteristic of “annealing-induced strengthening and toughening”.

Dependencies are inferred from the claim text.