Polyamide composition
AssigneeKuraray Co., Ltd.
InventorsNaoto SUGAI, Atsushi NANYA
Life of this patent
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Abstract
Provided is a polyamide composition, which has high moldability and excellent heat resistance and chemical resistance. The polyamide composition contains a polyamide (A) and an organic heat stabilizer (B), and in which the polyamide (A) contains a diamine unit (X) and a dicarboxylic acid unit (Y), the diamine unit (X) contains 0.1 mol % or more and less than 36 mol % of a diamine unit (X1), and the diamine unit (X1) is a constituent unit derived from an aliphatic diamine, in which the aliphatic diamine has 6 to 10 carbon atoms, the aliphatic diamine having an alkyl group having 2 or 3 carbon atoms bonded to a carbon atom at 2-position when a carbon atom to which any one of two amino groups is bonded is taken as 1-position.
Claims14
A polyamide composition comprising a polyamide (A) and an organic heat stabilizer (B), wherein
- the polyamide (A) comprises a diamine unit (X) and a dicarboxylic acid unit (Y),
- the diamine unit (X) comprises 0.1 mol % or more and less than 36 mol % of a diamine unit (X1), and
- the diamine unit (X1) is a constituent unit derived from an aliphatic diamine, wherein the aliphatic diamine has 6 to 10 carbon atoms, the aliphatic diamine having an alkyl group having 2 or 3 carbon atoms bonded to a carbon atom at 2-position when a carbon atom to which any one of two amino groups is bonded is taken as 1-position.
Dependencies are inferred from the claim text.