Housing Assembly, Housing Assembly Preparation Method, and Electronic Device
AssigneeHuawei Technologies Co., Ltd.
InventorsXutong Yang, Tianyi Xing, Chong Xing
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AssigneeHuawei Technologies Co., Ltd.
InventorsXutong Yang, Tianyi Xing, Chong Xing
Estimating the term…
A housing assembly includes a substrate, where the substrate includes a first surface and a second surface that are opposite to each other, the first surface of the substrate is close to an electronic device, and the substrate is formed through hot-pressing after glass fiber cloth is soaked in an epoxy resin adhesive solution; a first decoration layer, disposed on the first surface of the substrate; a light shielding layer, disposed on a surface that is of the first decoration layer and that is away from the substrate; and a second decoration layer, disposed on the second surface of the substrate. Therefore, the substrate uses a glass fiber epoxy resin plate, which is a light and thin material, and is high in strength, modulus, and transparency.
A housing assembly, comprising:
A method comprising:
An electronic device, comprising:
Dependencies are inferred from the claim text.