Manufacturing method for conductive substrate

Abstract

A manufacturing method for a conductive substrate having a conductive thin wire with a thin line width and excellent conductivity in which the intersection growing is suppressed. The manufacturing method includes a step of forming a mesh-shaped underlying silver pattern on a side of one surface of a base material by a photographic method, a step of disposing a resist film on the side of the surface of the base material on which the underlying silver pattern is formed, a step of exposing the resist film by irradiation of light from a side of a surface of the base material on which the underlying silver pattern is not formed, a step of developing the exposed resist film to form a resist pattern, and a step of performing a plating treatment using the underlying silver pattern as a seed layer to form a metal pattern on the underlying silver pattern.

Dependencies are inferred from the claim text.