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US 2025/0054130 A1Published application
Wafer Map Recognition Method Using Artificial Intelligence AND Computer Device
AssigneeMediatek Inc.
InventorsEn Jen, Shao-Yun Liu, Yi-Ju Ting, Chin-Tang Lai, Chia-Shun Yeh, Ching-Yu Lin, Ching-Han Jan, Po-Hsuan Huang
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Abstract
A wafer map recognition method using artificial intelligence includes obtaining wafer maps of a plurality of wafers; performing an unsupervised algorithm on the wafer map of each wafer in the plurality of wafers to generate a feature data set for the corresponding wafer map; and performing a clustering algorithm according to a plurality of feature data sets for the plurality of wafer maps to find a wafer map with a potential defect.
Claims16
A wafer map recognition method, comprising:
- obtaining wafer maps of a plurality of wafers;
- performing an unsupervised algorithm on the wafer map of each wafer in the plurality of wafers to generate a feature data set for the corresponding wafer map;
- and
- performing a clustering algorithm according to a plurality of feature data sets for the plurality of wafer maps to find a wafer map with a potential defect.
1 more element
A computer device, comprising:
- a processor;
- and
- a memory storing instructions, wherein the instructions are performed by the processor to perform:
- obtaining wafer maps of a plurality of wafers;
- performing an unsupervised algorithm on the wafer map of each wafer in the plurality of wafers to generate a feature data set for the corresponding wafer map;
- and
- performing a clustering algorithm according to a plurality of feature data sets for the plurality of wafer maps to find a wafer map with a potential defect.
4 more elements
Dependencies are inferred from the claim text.