Processing-in-memory (pim) high bandwidth memory (hbm) devices including pim dynamic random access memory (dram) dies
AssigneeSamsung Electronics Co., Ltd.
InventorsJeonil LEE, Jinwoo HAN, Seryeun YANG
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AssigneeSamsung Electronics Co., Ltd.
InventorsJeonil LEE, Jinwoo HAN, Seryeun YANG
Estimating the term…
There is provided a memory device including a processing-in-memory (PIM) dynamic random access memory (DRAM) die(s) and PIM-high bandwidth memory (HBM) devices. The memory device includes a core peripheral circuit structure including a bank core circuit including a row decoder and a sense amplifier of each of a plurality of banks, and a cell array structure disposed on the core peripheral circuit structure. The bank core circuit includes a plurality of sub core circuits correspondingly connected to the plurality of sub cell blocks, respectively. Each of the plurality of sub core circuits includes a sense amplifier segmented to be connected to a corresponding sub cell block, and a processing element connected to the segmented sense amplifier and configured to perform a logical operation on an operand that is data loaded into the segmented sense amplifier.
A memory device comprising:
A memory device comprising:
A memory device comprising:
(canceled)
Dependencies are inferred from the claim text.