US 2025/0053208 A1Published application

Computing system with cooling configuration

AssigneeSamsung Electronics Co., Ltd.

InventorsSungeun JO, Byungwoo BANG

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Abstract

A system includes a main board and sub-board units connected thereto. Each sub-board unit includes: a first sub-board connected to the main board and first chips arranged on a side of the first sub-board; a second sub-board connected to the main board and second chips arranged on a side of the second sub-board; and a cooling structure between the first sub-board and the second sub-board. The first sub-board and the second sub-board are arranged such that the side of the first sub-board and side of the second sub-board both face the cooling structure. A first region of the first sub-board defined by an outline of a first chip is directly opposite an identical second region of the second sub-board, and at least a portion of a second chip that corresponds to the first chip is outside the second region.

Claims20

Dependent claims

A computing system comprising:

a main board;
and
sub-board units connected to the main board,
wherein each sub-board unit comprises:
a first sub-board electrically connected to the main board and comprising first chips arranged on a side of the first sub-board;
a second sub-board electrically connected to the main board and comprising second chips arranged on a side of the second sub-board;
and
a cooling structure sandwiched between the first sub-board and the second sub-board,
wherein the first sub-board and the second sub-board are arranged such that the side of the first sub-board and side of the second sub-board both face the cooling structure, and
wherein a first region of the first sub-board defined by an outline of a first chip, among the first chips, wherein the first region is directly opposite an identical second region of the second sub-board, and wherein at least a portion of a second chip, among the second chips, that corresponds to the first chip, is outside the second region.

7 more elements

An electronic device comprising:

a main board;
and
sub-board units connected to the main board,
each sub-board unit comprising:
a cooling structure disposed between a first sub-board and a second sub-board;
the first sub-board electrically connected to the main board and comprising first chips arranged on a surface of the first sub-board that faces the cooling structure and that faces the second sub-board;
the second sub-board electrically connected to the main board and comprising second chips disposed on a surface of the second sub-board that faces the cooling structure and that faces the first sub-board;
and
wherein the first sub-board and the second sub-board are arranged such that tops of the first chips and tops of the second chips face the cooling structure, and
wherein, from a direction perpendicular to the first and second sub-boards, at least a partial region a second chip among the second chips does not overlap with any of the first chips.

7 more elements

Dependencies are inferred from the claim text.