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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShao-Hua WANG, Kueilin HO, Cheng Wei SUN, Zong-You YANG, Chih-Chun CHIANG, Yi-Fam SHIU, Chueh-Chi KUO, Heng-Hsin LIU, Li-Jui CHEN
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Some implementations described herein include operating components in a lithography system at variable speeds to reduce, minimize, and/or prevent particle generation due to rubbing of or collision between contact parts of the components. In some implementations, a component in a path of transfer of a semiconductor substrate in the lithography system is operated at a relatively high movement speed through a first portion of an actuation operation, and is operated at a reduced movement speed (e.g., a movement speed that is less than the high movement speed) through a second portion of the actuation operation in which contact parts of the component are to interact. The reduced movement speed reduces the likelihood of particle generation and/or release from the contact parts when the contact parts interact, while the high movement speed provides a high semiconductor substrate throughput in the lithography system.
A method, comprising:
A method, comprising:
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Dependencies are inferred from the claim text.