Resist underlayer composition, and method of forming patterns using the composition
AssigneeSamsung SDI Co., Ltd.
InventorsAhra CHO, Yoojeong CHOI, Jaeyeol BAEK, Soonhyung KWON, Hwayoung JIN, Seongjin KIM
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AssigneeSamsung SDI Co., Ltd.
InventorsAhra CHO, Yoojeong CHOI, Jaeyeol BAEK, Soonhyung KWON, Hwayoung JIN, Seongjin KIM
Estimating the term…
Disclosed are a resist underlayer composition, and a method of forming a pattern using the resist underlayer composition. The resist underlayer composition includes a polymer including a structural unit represented by Chemical Formula 1, a structural unit represented by Chemical Formula 2, or a combination thereof, a photoacid generator having a mass reduction rate of about 0% after 3 minutes from the time of measurement during thermogravimetric analysis (TGA) at 205° C. in an air atmosphere (air gas), and a solvent. The definitions of Chemical Formula 1 and Chemical Formula 2 are as described in the specification.
A resist underlayer composition, comprising:
Dependencies are inferred from the claim text.