Photonic package and method for forming the same

A method of forming a semiconductor package, comprising:

• forming a micro lens recessed from a top surface of a substrate, wherein a concave area is formed between a surface of the micro lens and the top surface of the substrate;
• depositing a dielectric material that fills the concave area and covers the top surface of the substrate using a spin coating process;
• patterning the dielectric material to leave only a portion of the dielectric material in the concave area using a photolithography process;
• planarizing the dielectric material that has been patterned;
• forming a bonding layer on the planarized dielectric material and over the top surface of the substrate;
• and
• bonding a semiconductor wafer to the substrate via the bonding layer.

A semiconductor package comprising:

• a substrate;
• a micro lens recessed from a top surface of the substrate, wherein a concave area is formed between a surface of the micro lens and the top surface of the substrate;
• a first dielectric material disposed on the concave area and being close the surface of the micro lens;
• a second dielectric material filling the concave area and being over the first dielectric material, wherein the second dielectric material is different from the first dielectric material;
• a bonding layer formed over the top surface of the substrate and contacting with the second dielectric material;
• and
• a semiconductor wafer bonded to the bonding layer, wherein the semiconductor wafer includes an optical component therein.