Molding apparatus and device formed by molding apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChien-Ling Hwang
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Abstract
A molding apparatus includes a mold chase and a sensor. The mold chase includes an upper portion and a lower portion engaged with the upper portion to form a cavity therebetween for receiving a workpiece. The upper portion includes a top surface and an alignment mark on the top surface. A pattern is provided on at least one of inner surfaces of the upper and lower portions. The sensor facing the mold chase is configured to detect the alignment mark of the upper portion and a position of the workpiece in the mold chase.
Claims20
An apparatus, comprising:
- a mold chase comprising:
- an upper portion comprising a top surface and an alignment mark on the top surface;
- and
- a lower portion engaged with the upper portion to form a cavity therebetween for receiving a workpiece, wherein a pattern is provided on at least one of inner surfaces of the upper and lower portions;
- and
- a sensor facing the mold chase and detect the alignment mark of the upper portion and a position of the workpiece in the mold chase.
A device, comprising:
- a semiconductor structure;
- and
- an optically molded layer covering the semiconductor structure, the optically molded layer comprising a first light-guide element disposed over a first surface of the semiconductor structure and optically coupled to the semiconductor structure.
A method, comprising:
- forming an optically molded layer by using a molding apparatus comprising:
- engaging an upper portion of a mold chase with a lower portion of the mold chase to form a cavity, wherein a pattern is provided on at least one of inner surfaces of the upper and lower portions;
- filling the cavity with a moldable material;
- and
- curing the moldable material, wherein the mold chase imprints the pattern in the moldable material to form the optically molded layer with a corresponding pattern, and the corresponding pattern functions as a light-guide element.
Dependencies are inferred from the claim text.