Photonic assembly including an embedded optical connector die and methods for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Hsing-Kuo Hsia, Chih-Wei Tseng, Jiun Yi Wu
Life of this patent
Estimating the term…
Abstract
A photonic assembly includes a composite die. The composite die includes: a photonic integrated circuits (PIC) die including waveguides and photonic devices therein; an electronic integrated circuits (EIC) die including semiconductor devices therein; and an embedded optical connector die contacting a top surface of the PIC die and laterally spaced from the EIC die.
Claims20
A photonic assembly comprising a composite die, wherein the composite die comprises:
- a photonic integrated circuits (PIC) die comprising waveguides and photonic devices therein;
- an electronic integrated circuits (EIC) die comprising semiconductor devices therein;
- and
- an embedded optical connector die contacting a top surface of the PIC die and laterally spaced from the EIC die.
A photonic assembly comprising a composite die, wherein the composite die comprises:
- a photonic integrated circuits (PIC) die comprising waveguides and photonic devices therein;
- an electronic integrated circuits (EIC) die comprising semiconductor devices therein;
- a support semiconductor substrate overlying the PIC die and the EIC die, wherein the composite die is configured to provide a beam path that extends through the support semiconductor substrate;
- and
- an embedded optical connector die comprising an optical element located within, or at a terminal of the beam path.
A method of forming a photonic assembly, the method comprising:
- providing a photonic integrated circuits (PIC) die comprising waveguides and photonic devices therein;
- bonding an electronic integrated circuits (EIC) die comprising semiconductor devices therein to the PIC die;
- attaching an optical connector die comprising an optical element to the PIC die;
- and
- forming a dielectric matrix around the optical connector die on a sidewall of the EIC die.
Dependencies are inferred from the claim text.