Resin panel for infrared sensor, and infrared sensor and article employing said resin panel
AssigneeDai Nippon Printing Co., Ltd.
InventorsKatsuya SAKAYORI, Tomoki YAMAGATA
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Abstract
Provided is a resin panel which, when applied as a protective cover of an infrared sensor, can inhibit an infrared sensor from being deteriorated in accuracy. A resin panel for an infrared sensor, the resin panel comprising a resin layer and a plastic film, as well as comprising a conductive layer and a pressure-sensitive adhesive layer between the resin layer and the plastic film, and satisfying at least one of the following expressions (1) and (2): 50 μm≤thickness of the pressure-sensitive adhesive layer . . . (1); and 30≤T×Y3 . . . (2); wherein “T” represents a thickness (unit: “μm”) of the plastic film, and “Y” represents a Young's modulus (unit: “GPa”) of the plastic film.
Claims30
A resin panel for an infrared sensor, the resin panel
- comprising a resin layer and a plastic film, as well as comprising a conductive layer and a pressure-sensitive adhesive layer between the resin layer and the plastic film, and
- satisfying at least one of the following expressions (1) and (2):
- 50
-
- μ
-
- m
- ≤
- thickness
-
- of
-
- the
-
- pressure
- -
- sensitive
-
- adhesive
-
- layer
- (
- 1
- )
- 30
- ≤
- T
- ×
- Y
- 3
- (
- 2
- )
- wherein “T” represents a thickness (unit:
- “μm”) of the plastic film, and “Y” represents a Young's modulus (unit:
- “GPa”) of the plastic film.
A resin panel for an infrared sensor, the resin panel
- comprising a resin layer and a plastic film, as well as comprising a conductive layer between the resin layer and the plastic film, and
- satisfying the following expression (3):
- 30
- ≤
- T
- ×
- Y
- 3
- (
- 3
- )
- wherein “T” represents a thickness (unit:
- “μm”) of the plastic film, and “Y” represents a Young's modulus (unit:
- “GPa”) of the plastic film.
Dependencies are inferred from the claim text.