Multi-sectional vapor chambers
AssigneeIntel Corporation
InventorsShantanu Kulkarni, Jeff Ku, Baomin Liu, Tongyan Zhai, Min Suet Lim, Chee Chun Yee, Eng Huat Goh, Jun Liao, Kavitha Nagarajan
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Abstract
Systems, apparatus, articles of manufacture, and methods related to multi-sectional vapor chambers for electronic devices are disclosed. An example vapor chamber includes a first panel, a second panel, and a wall extending between the first panel and the second panel to separate the vapor chamber into a first section and a second section between both the first panel and the second panel, the wall including insulation.
Claims20
A vapor chamber for an electronic device, the vapor chamber comprising:
- a first panel;
- a second panel;
- and
- a wall extending between the first panel and the second panel to separate the vapor chamber into a first section and a second section between the first panel and the second panel, the wall including insulation.
An apparatus comprising:
- a first vapor chamber;
- a second vapor chamber;
- and
- an insulation fence coupling the first vapor chamber to the second vapor chamber.
An electronic device comprising:
- a first heat generating component;
- a second heat generating component;
- and
- a multi-sectional vapor chamber including:
- a first section coupled to the first heating generating component;
- a second section coupled to the second heat generating component;
- and
- a thermal insulation wall separating the first section and the second section.
Dependencies are inferred from the claim text.