Vapor chamber heatsink assembly

A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising:

• a vapor chamber, including a lower casing and an upper casing;
• wherein the lower casing comprises:
• a lower chamber surface;
• and
• a contact surface opposite the lower chamber surface;
• wherein the lower chamber surface comprises:
• a plurality of lower obstructers, each plurality of lower obstructers has a lower obstructer geometric shape;
• and
• a plurality of lower flow channels,
• wherein the plurality of lower obstructers is arranged on the lower chamber surface and the plurality of lower obstructers protrude from the lower chamber surface to define the plurality of lower flow channels between each neighboring plurality of lower obstructers;
• and
• wherein the upper casing comprises:
• an upper chamber surface;
• and
• a mounting surface opposite the upper chamber surface;
• wherein the upper chamber surface comprises:
• a plurality of upper obstructers, each plurality of upper obstructer has an upper obstructer geometric shape;
• and
• a plurality of upper flow channels;
• wherein the plurality of upper obstructers is arranged on the upper chamber surface and the plurality of upper obstructers protrude from the upper chamber surface to define the plurality of upper flow channels between each neighboring plurality of upper obstructers;
• wherein the lower obstructer geometric shape of each plurality of lower obstructers is equal to a corresponding upper obstructer geometric shape of each plurality of upper obstructers;
• wherein the lower casing and the upper casing are vacuum-sealed together, whereby lower obstructer surfaces of each plurality of lower obstructers is combined with upper obstructer surfaces of each plurality of upper obstructers to form a plurality of obstructers and the plurality of lower flow channels are combined with the plurality of upper flow channels to form a plurality of flow channels;
• and
• wherein the working fluid is disposed in the plurality of flow channels;
• and
• a plurality of heatsink fins disposed on the mounting surface, each plurality of heatsink fins span across a width of the mounting surface, each plurality of heatsink fins together form a plate fin heat sink on the vapor chamber.