US 2025/0052460 A1 · THERMAL MANAGEMENT MODULE

Abstract

A thermal management module includes a thermal management component, a support component and a communication component. The support component includes a first surface and a second surface. The thermal management component is located at least partially on a side of the first surface. The communication component is located at least partially on a side of the second surface. The thermal management component is connected to the side of the first surface. The communication component is connected to the side of the second surface. The support component has a transfer hole communicating with the thermal management component and the communication component. The communication component has a channel communicating with the transfer hole. The thermal management component includes at least two sub-components. The thermal management module has a flow channel communicating with at least two sub-components. The transfer hole and the channel are at least part of the flow channel.

Claims20

Dependent claims

A thermal management module, comprising:

a thermal management component;
a support component;
and
a communication component;
wherein the support component comprises a first surface and a second surface which are disposes in a thickness direction thereof, the thermal management component is at least partially located on a side of the first surface;
the communication component is at least partially located on a side of the second surface;
the thermal management component is connected to the side of the first surface, and the communication component is connected to the side of the second surface;
the support component defines a transfer hole that communicates with the thermal management component and the communication component;
the communication component defines a channel located inside the communication component, and the channel is in communication with the transfer hole;
the thermal management component comprises at least two sub-components, the thermal management module defines a flow channel communicating with the at least two sub-components, and the transfer hole and the channel are at least part of the flow channel.

7 more elements

A thermal management module, comprising:

a thermal management component;
a support component, the support component supporting the thermal management component;
and
a communication component;
wherein the thermal management component comprises a first sub-component and a second sub-component, the thermal management module comprises a connection portion connecting the first sub-component and the communication component, the connection portion communicates with the first sub-component and the communication component, the first sub-component and the second sub-component are in communication at least through the connection portion and the communication component;
the connection portion extends from one side to another side along a thickness direction of the support component;
the connection portion is part of the first sub-component, or the connection portion is part of the communication component.

4 more elements

Dependencies are inferred from the claim text.

Thermal management module

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Thermal management module

Life of this patent

Abstract

Claims20