Electronic component mounting structure and outdoor unit of air conditioner
AssigneeMitsubishi Electric Corporation
InventorsHiroki SUZUKI, Keiji HARADA
Life of this patent
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Abstract
An electronic component mounting structure includes an electronic component, a metal plate having one surface and another surface, and a heat dissipation component having flexibility and elasticity. The heat dissipation component is sandwiched between the one surface of the metal plate and the electronic component with a region of the heat dissipation component that faces the electronic component being deformed along the shape of the electronic component and being in intimate contact with the electronic component, and the heat dissipation component being in intimate contact with the one surface of the metal plate. The electronic component and the metal plate are thermally connected via the heat dissipation component.
Claims19
An electronic component mounting structure comprising:
- an electronic component;
- a metal plate including one surface and another surface;
- and
- a heat dissipation component having flexibility and elasticity,
- a substrate holder disposed above the one surface of the metal plate;
- and an electronic substrate held on the substrate holder, wherein
- the heat dissipation component is sandwiched between the one surface of the metal plate and the electronic component with a region of the heat dissipation component that faces the electronic component being deformed along a shape of the electronic component and being in intimate contact with the electronic component, and the heat dissipation component being in intimate contact with the one surface of the metal plate,
- the electronic component and the metal plate are thermally connected via the heat dissipation component, and
- the electronic component and the electronic substrate are electrically connected via a connector between the electronic component and the electronic substrate.
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An electronic component mounting structure comprising:
- an electronic component;
- a metal plate including one surface and another surface;
- and
- a heat dissipation component having flexibility and elasticity, wherein
- the heat dissipation component is sandwiched between the one surface of the metal plate and the electronic component with a region of the heat dissipation component that faces the electronic component being deformed along a shape of the electronic component and being in intimate contact with the electronic component, and the heat dissipation component being in intimate contact with the one surface of the metal plate, wherein
- the heat dissipation component includes a recess formed along a shape of a contact portion in which the electronic component is in contact with the heat dissipation component, and
- the electronic component and the metal plate are thermally connected via the heat dissipation component.
An electronic component mounting structure comprising:
- an electronic component;
- a metal plate including one surface and another surface;
- and
- a heat dissipation component having flexibility and elasticity, wherein
- the heat dissipation component is sandwiched between the one surface of the metal plate and the electronic component with a region of the heat dissipation component that faces the electronic component being deformed along a shape of the electronic component and being in intimate contact with the electronic component, and the heat dissipation component being in intimate contact with the one surface of the metal plate, and
- the heat dissipation component includes, as two types of heat dissipation components having different flexibility and elasticity, a first heat dissipation component having relatively high flexibility and a second heat dissipation component having relatively high elasticity,
- the first heat dissipation component is disposed on a surface in contact with the electronic component,
- the electronic component and the metal plate are thermally connected via the heat dissipation component.
Dependencies are inferred from the claim text.