US 2025/0051954 A1 · ELECTROPLATING DEVICE

Abstract

An electroplating device includes a process chamber, a substrate holding device, a first cover body, a second cover body, a gas supply part and an exhaust part. The electroplating solution is contained in the inner chamber of the process chamber and the inner chamber has an opening. The substrate holding device is used for holding a substrate, and the substrate holding device is moved into or out of the inner chamber through the opening. The first cover body is connected to the substrate holding device to close the opening after the substrate holding device is moved into the inner chamber, so that the inner chamber is in a closed state. The second cover body is used for closing the opening after the substrate holding device is moved out of the inner chamber, so that the inner chamber is in the closed state again.

Claims11

Dependent claims

An electroplating device, comprising:

a process chamber, having an inner chamber for holding the electroplating solution, the inner chamber having an opening;
a substrate holding device, holding a substrate and moving into or out of the inner chamber through the opening;
a first cover body, connected to the substrate holding device to close the opening after the substrate holding device is moved into the inner chamber so that the inner chamber is in a closed state;
a second cover body, closing the opening after the substrate holding device is moved out of the inner chamber so that the inner chamber is in a closed state;
a gas supply part, introducing an inert gas into the inner chamber;
and
an exhaust part, discharging air from the inner chamber.

4 more elements

Dependencies are inferred from the claim text.

Electroplating device

Life of this patent

Electroplating device

Life of this patent

Abstract

Claims11