Methdos and systems for filling a gap
AssigneeASM IP Holding B.V.
InventorsTimothee Blanquart, René Henricus Jozef Vervuurt
Life of this patent
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Abstract
Disclosed are methods and systems for filling a gap. An exemplary method comprises providing a substrate to a reaction chamber. The substrate comprises the gap. The method further comprises forming a convertible layer on the substrate and exposing the substrate to a conversion reactant. Accordingly, at least a part of the convertible layer is converted into a gap filling fluid. The gap filling fluid at least partially fills the gap. The methods and systems are useful, for example, in the field of integrated circuit manufacture.
Claims19
A method for filling a gap, the method comprising:
- providing a substrate to a reaction chamber, the substrate comprising the gap;
- forming a convertible layer on the substrate;
- and,
- exposing the substrate to a liquid phase conversion reactant, thereby converting at least part of the convertible layer into a gap filling fluid;
- wherein the gap filling fluid at least partially fills the gap.
A multi-chamber reactor system comprising:
- a first reaction chamber configured to deposit a material layer on a substrate;
- and
- a second reaction chamber configured to expose the material layer to a halogen reactant to form a flowable layer.
Dependencies are inferred from the claim text.