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US 2025/0051923 A1Published application
Methods of depositing materials onto 2-dimensional layered materials
AssigneeOxford Instruments Nanotechnology Tools Limited
InventorsSarah RIAZIMEHR, Harm KNOOPS, Ravi SUNDARAM
Life of this patent
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Abstract
A method for plasma deposition of materials onto a 2-dimensional layer of a first substrate, the method comprising: depositing a protective layer directly onto the 2-dimensional layer in a pulsed plasma deposition process; and depositing a second layer onto the protective layer in a second plasma deposition process.
Claims20
A method for plasma deposition of materials onto a 2-dimensional layer of a first substrate, the method comprising:
- depositing a protective layer directly onto the 2-dimensional layer in a pulsed plasma deposition process;
- and
- depositing a second layer onto the protective layer in a second plasma deposition process.
A method for deposition of materials onto a 2-dimensional layer of a first substrate, the method comprising:
- depositing a protective layer directly onto the 2-dimensional layer in a radical enhanced atomic layer deposition process;
- and
- depositing a second layer onto the protective layer in a second deposition process.
Dependencies are inferred from the claim text.