Substrate-processing apparatus and substrate-processing method
AssigneeTokyo Electron Limited
InventorsYudai FUKUSHI, Junnosuke TAGUCHI, Yasushi TAKEUCHI, Takehiro FUKADA
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Abstract
A substrate-processing apparatus includes a process chamber configured to process a plurality of substrates; a rotation table that is disposed in an interior of the process chamber so as to be rotatable and at which the substrates are to be placed at positions that are away in a radial direction of the rotation table from a center of rotation of the rotation table; a supply member configured to supply gas to the substrates placed on the rotation table; and a raising and lowering mechanism configured to raise and lower the supply member relative to the rotation table.
Claims12
A substrate-processing apparatus, comprising:
- a process chamber configured to process a plurality of substrates;
- a rotation table that is disposed in an interior of the process chamber so as to be rotatable and at which the substrates are to be placed at positions that are away in a radial direction of the rotation table from a center of rotation of the rotation table;
- a supply member configured to supply gas to the substrates placed on the rotation table;
- and
- a raising and lowering mechanism configured to raise and lower the supply member relative to the rotation table.
A substrate-processing method performed by a substrate-processing apparatus that includes a process chamber configured to process a plurality of substrates;
- a rotation table that is disposed in an interior of the process chamber so as to be rotatable and at which the substrates are to be placed at positions that are away in a radial direction of the rotation table from a center of rotation of the rotation table;
- a supply member configured to supply gas to the substrates placed on the rotation table;
- and a raising and lowering mechanism configured to raise and lower the supply member relative to the rotation table, the substrate-processing method comprising:
- disposing the supply member at a raised position that is higher than a processing position at which the supply member is to be disposed upon processing the substrates, before the substrates are transferred onto the rotation table from an exterior of the process chamber.
Dependencies are inferred from the claim text.