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US 2025/0051882 A1Published application
Copper alloy powder
AssigneeMitsubishi Materials Corporation
InventorsYuki Ito, Jun Kato, Yoshiyuki Nagatomo
Life of this patent
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Abstract
This copper alloy powder includes a copper alloy that contains 5% by mass or more and 50% by mass or less of Ni. This copper alloy powder may contain 45% by mass or more and 95% by mass or less of Cu. This copper alloy powder may contain 1% by mass or more and 42% by mass or less of Zn. This copper alloy powder may contain 7% by mass or less of Mn.
Claims20
A copper alloy powder comprising a copper alloy that contains 5% by mass or more and 50% by mass or less of Ni.
Dependencies are inferred from the claim text.