Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the same
OwnerThanikaivelan Tindivanam Veeraraghavan, Ramanathan Lakshminarayaninventors
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Abstract
One-component electromagnetic curable novel toughened epoxy-hybrid structural adhesives, generally including: (a) a bisphenol A liquid epoxy resin, (b) a bisphenol F liquid epoxy resin, (c) a bisphenol A solid epoxy resin, (d) a novel toughening agent, (e) one or more mineral fillers, and (f) a curing agent. The structural adhesives of the present invention can be cured within seconds and are useful for a plurality of applications, including bonding OEM closure panel components, such as doors, hoods, fenders, etcetera.
Claims21
1-20. (canceled)
A rapid-curing structural adhesive composition, comprising:
- a liquid epoxy resin component comprising a bisphenol A liquid epoxy resin and a bisphenol F liquid epoxy resin;
- a solid epoxy resin component comprising a bisphenol A solid epoxy resin;
- a toughening agent comprising an epoxy-terminated polyurethane interpenetrating network;
- at least one filler material;
- a curing agent system comprising a modified imidazole curing agent and a latent amine curing agent;
- and
- wherein the composition develops a shear strength of approximately 3 to approximately 7 MPa when exposed to an electromagnetic field at approximately 190° C. for approximately 4 seconds.
A one-component structural adhesive composition, comprising:
- approximately 30 to approximately 50 percent by weight bisphenol A liquid epoxy resin;
- approximately 40 to approximately 60 percent by weight bisphenol F liquid epoxy resin;
- approximately 5 to approximately 15 percent by weight bisphenol A solid epoxy resin;
- approximately 5 to approximately 15 percent by weight epoxy-terminated polyurethane interpenetrating network toughening agent;
- approximately 2 to approximately 10 percent by weight filler material;
- approximately 2 to approximately 7 percent by weight modified imidazole curing agent;
- approximately 6 to approximately 10 percent by weight latent amine curing agent;
- and
- wherein the composition is electromagnetically curable.
A method for bonding substrates, comprising the steps of:
- applying a one-component epoxy adhesive composition to at least one substrate surface, the composition comprising:
- a bisphenol A liquid epoxy resin;
- a bisphenol F liquid epoxy resin;
- a bisphenol A solid epoxy resin;
- an epoxy-terminated polyurethane interpenetrating network toughening agent;
- at least one filler material;
- and
- a curing agent system;
- assembling the substrates with the adhesive composition therebetween;
- and
- electromagnetically curing the adhesive composition at approximately 190° C. for approximately 4 seconds to develop a shear strength of approximately 3 to approximately 7 MPa.
Dependencies are inferred from the claim text.