Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and bonded body
AssigneeNitto Denko Corporation
InventorsDaisuke TSUMURA, Ginji MIZUHARA, Tomoharu KURODA
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Abstract
An object of the present invention is to provide a pressure-sensitive adhesive composition whose adhesive force is sufficiently reduced by applying a voltage even after storage in a high-temperature and high-humidity environment. The present invention relates to a pressure-sensitive adhesive composition containing a first polymer as a base polymer and an ionic liquid and further containing a second polymer having a glass transition temperature Tg of 40° C. to 180° C.
Claims14
A pressure-sensitive adhesive composition containing a first polymer as a base polymer and an ionic liquid, the pressure-sensitive adhesive composition further comprising:
- a second polymer having a glass transition temperature (Tg) of 40° C. to 180° C.
Dependencies are inferred from the claim text.