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US 2025/0051606 A1Published application
Two-component polyurethane adhesive composition
AssigneeDdp Specialty Electronic Materials US, LLC
InventorsHuide ZHU, Tyler AUVIL, Matthew FELDPAUSCH, Gavin VOGEL, Thomas CLARK, Mansour MIRDAMADI, Andreas LUTZ
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Abstract
Provided herein is a two-component polyurethane adhesive composition.
Claims21
A thermally conductive, two-component polyurethane adhesive composition comprising:
- (A) a polyisocyanate component, Component A, comprising:
- (a1) at least one polyisocyanate;
- (a2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component A;
- (a3) optionally a polyether polyol;
- (a4) optionally a silane adhesion promoter;
- (B) a polyol component, Component B, comprising:
- (b1) at least one polyetherpolyol;
- (b2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component B;
- (b3) a catalyst capable of catalyzing the reaction of an isocyanate and a polyol;
- (b4) optionally a silane adhesion promoter;
- wherein at least one of the polyether polyols in Component A and Component B is a poly(tetramethylene oxide) glycol, and wherein the equivalent ratio of the isocyanate from Component A over the hydroxyl from Component B is from 0.8 to 2.0.
8 more elements
(canceled)
A thermally conductive, two-component polyurethane adhesive composition comprising:
- (A) a polyisocyanate component, Component A, comprising:
- (a1) at least one polyisocyanate;
- (a2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component A;
- (a3) optionally a polyether polyol;
- (a4) optionally a silane adhesion promoter;
- (B) a polyol component, Component B, comprising:
- (b1) at least one polyetherpolyol, comprising poly(tetramethylene oxide) glycol;
- (b2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component B;
- (b3) a catalyst capable of catalyzing the reaction of an isocyanate and a polyol;
- and
- (b4) optionally a silane adhesion promoter;
- wherein the equivalent ratio of the isocyanate from Component A over the hydroxyl from Component B is from 0.8 to 2.0.
9 more elements
A thermally conductive, two-component polyurethane adhesive composition comprising:
- (A) a polyisocyanate component, Component A, comprising:
- (a1) at least one polyisocyanate, comprising polycarbodiimide-modified MDI;
- (a2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component A;
- (a3) optionally a polyether polyol;
- (a4) optionally a silane adhesion promoter;
- (B) a polyol component, Component B, comprising:
- (b1) at least one polyetherpolyol, comprising poly(tetramethylene oxide) glycol;
- (b2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component B;
- (b3) a catalyst capable of catalyzing the reaction of an isocyanate and a polyol;
- and
- (b4) optionally a silane adhesion promoter;
- wherein the equivalent ratio of the isocyanate from Component A over the hydroxyl from Component B is from 0.8 to 2.0.
9 more elements
A thermally conductive, two-component polyurethane adhesive composition comprising:
- (A) a polyisocyanate component, Component A, comprising:
- (a1) at least one polyisocyanate;
- (a2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component A;
- (a3) optionally a polyether polyol;
- (a4) optionally a silane adhesion promoter;
- (B) a polyol component, Component B, comprising:
- (b1) at least one polyetherpolyol, comprising at least 8 wt % poly(tetramethylene oxide) glycol, based on the total weight of Component B;
- (b2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component B;
- (b3) a catalyst capable of catalyzing the reaction of an isocyanate and a polyol;
- and
- (b4) optionally a silane adhesion promoter;
- wherein the equivalent ratio of the isocyanate from Component A over the hydroxyl from Component B is from 0.8 to 2.0.
9 more elements
A thermally conductive, two-component polyurethane adhesive composition comprising:
- (A) a polyisocyanate component, Component A, comprising:
- (a1) at least one polyisocyanate, comprising polycarbodiimide-modified MDI;
- (a2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component A;
- (a3) optionally a polyether polyol;
- (a4) optionally a silane adhesion promoter;
- (B) a polyol component, Component B, comprising:
- (b1) at least one polyetherpolyol, comprising at least 8 wt % poly(tetramethylene oxide) glycol, based on the total weight of Component B;
- (b2) 40 to 85 wt % thermally conductive filler, based on the total weight of Component B;
- (b3) a catalyst capable of catalyzing the reaction of an isocyanate and a polyol;
- and
- (b4) optionally a silane adhesion promoter;
- wherein the equivalent ratio of the isocyanate from Component A over the hydroxyl from Component B is from 0.8 to 2.0.
9 more elements
-51. (canceled)
Dependencies are inferred from the claim text.